New
Various Options, Tailored Specifications
The ELS-ORCA is the 30 kV electron beam lithography system which can be customized with various options such as the 50 kV acceleration voltage, dynamic focusing/stigma, and the height sensor assist focus adjustment. With a combination of these options, the ELS-ORCA becomes a tailored system that meets individual requirements of researchers.
User-friendly Software
The new machine control software "elms" is preinstalled onto the ELS-ORCA system. The elms is a comprehensive suite of modules such as CAD data conversion, beam adjustment, exposure, and SEM observation. This modular system makes necessary functions more reachable and your workflow more productive. The account management function of the elms can restrict the accessibility to functions depending on users.
Retarding Option for SEM Imaging
The retarding option of the ELS-ORCA allows for low-damage/high-resolution SEM observations. With its low acceleration voltage equivalent to SEM system, the ELS-ORCA enables you to observe up to 6-inch area for 8-inch wafers. Automatic SEM observation using CAD data prepared for exposure is also available.
| TFE Filament | ZrO/W Thermal field emitter | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Acceleration Voltage | 1 ~ 30 kV | 1 ~ 50 kV ※Option | ||||||||||||
| Minimum Beam Diameter | D 2.0 nm | D 1.6 nm | ||||||||||||
| Beam Current | 5 pA ～ 80 nA | |||||||||||||
| Scan Clock | 100 MHz | |||||||||||||
| Shot Pitch | Min. 0.1 nm | |||||||||||||
| Max. Field Size | 1000 µm□ | |||||||||||||
| Max. Sample Size | 8” Wafer | |||||||||||||
| Max. Exposure Area | 150 mm x 150 mm | |||||||||||||
| Loading Mechanism | Single AutoLoader | |||||||||||||
| Software | elms • Beam adjustment • Exposure schedule • Pattern data conversion • Account management • Python scripting | |||||||||||||