Your Perfect Research Partner
The ELS-BODEN Series Systems are dedicated to those customers seeking to fabricate devices where ultra-fine patterns are most important. The ELS-BODEN Series EBL tools offer up to a 300mm square writing area and can hold samples from small pieces up to 300mm wafers, as well as 9 inch masks. A complete line of autoloaders are available.
ELS-BODEN acceleration voltages are: 50kV, 100kV, 125kV, 150kV
A Revolutionary Leap in 30 kV EBL
The ELS-ORCA offers cutting-edge performance on a customized platform for R&D applications. Various options can include automatic focusing, dynamic focus correction, and the flexibility to increase acceleration voltage up to 50kV. In addition, a high resolution SEM imaging option, with beam retarding capability, offers excellent sample observation at a low acceleration voltage. This allows the end-user to precisely calibrate the lithographic process against the CAD layout.
Higher Throughput than Existing EBL
Reaching sub-micron scales unachievable via laser lithography. Designed for low volume device fabrication with minimal line edge roughness.
Beyond EBL
The ELS-HAYATE enables full 8-inch wafer size fabrications of nanoimprint molds within hours. From high-mix to low-volume poduction, the ELS-HAYATE is perfect for large fabrication write fields where high throughput and ultra-fine pattern resolution is required.
Sales Headquarters (Hachioji City, Tokyo)
TEL: +81-42-626-0611
Hours: Monday-Friday 8:30-17:30
Except Weekends, National Holidays, and Year-end and New Year Holidays