3D Roughness Analysis Scanning Electron Microscope ERA-nanoR

【To customers considering the ERA series】

Notice of Order Suspension

Thank you very much for your interest in our products. Due to an unexpectedly high volume of orders, we are currently unable to keep up with production and have therefore temporarily suspended the acceptance of new orders and requests for demo evaluations. We will provide an update on when we will resume these services as we monitor our production status. We sincerely apologize for any inconvenience this may cause and appreciate your understanding.

Electron Beam Edge Analysis System

ERA-nanoR

Measurement and Analysis Equipment

Electron Beam Edge Analysis System

Key Features

Quantifying the R (radius of curvature) and surface roughness of nano-scale edges

Using ultra-fine measurement and analysis technology based on electron beams, we quantify the shape and roughness of cutting edges on precision machining tools.
This enables comparison and analysis at the nano-scale—a feat that was difficult to achieve with existing measurement methods, such as optical techniques.

Edge Analysis Functions

This system allows you to analyze and compare the condition of the cutting edge—a critical factor in fine machining that cannot be fully captured by optical devices—using various functions such as radius of curvature analysis, ridge line analysis, and geometric error analysis, in addition to examining the surface characteristics of the rake and flank faces, which are hidden factors that determine cutting performance.

Elemental Analysis and Crystal Orientation Analysis (Optional)

Optional features such as elemental analysis and crystal orientation analysis can be added.
In addition to standard SEM images and geometric measurement data, a wide range of information—including elemental mapping images—can be obtained quickly.
The 3D elemental mapping function allows for the analysis of elemental height information on the nano- to micron-scale, enabling the detection of issues such as coating delamination and foreign element adhesion.

Key Specifications

	High-Resolution System	Standard System
Resolution	1.2 nm (30 kV) 5 nm (1 kV)	3.5 nm (35 kV)
Electron Gun	ZrO/W Thermionic Field Emission Type	Pre-centered Tungsten
Acceleration voltage	0.3 ～ 30 kV	0.3 ～ 35 kV
Magnification	20 ～ 600,000Magnification	10 ～ 400,000Magnification
Detectors	4 secondary electron detectors, 1 4-channel reflection electron detector
Image Observation	Difference-signal texture-enhanced secondary electron image, sum-signal composition-enhanced secondary electron image, standard secondary electron image, backscattered electron image
Image Format	BMP、JPG、TIFF、PNG
Observation Monitor	27-inch LCD
Auto Functions	Contrast, Brightness, Focus, Stigma
Sample Size	Please consult us regarding sample size (Sample examples: Φ150 x H30, L250 x W50 x H30 mm, 8-inch Φ, etc.).
Stage Drive	X, Y, Z, R, T
Sample Travel Range	X：0 ～ 50 mm Y：0 ～ 155 mm
	Z：4 ～ 36 mm	Z：8 ～ 40 mm
	R：360-Degree Continuous Endless
	T：-7 ～ +70°
Exhaust System	Turbo molecular pump, oil-sealed rotary pump, ion pump	Turbo molecular pump, oil-sealed rotary pump
Z-axis resolution	1 nm
Number of Measurement Points	LINE Measurement (both X and Y directions): Up to 32,767 points; 3D Measurement: Up to 4,800 x 3,600 points
Length Measurement Function	Distance between two points in the X, Y, and Z directions; tilt angle
Surface Topography Analysis Functions	Bird’s-eye view, contour map, number of peaks, grain size, area ratio, JIS standard roughness parameters
Edge Analysis Functions	Cutting edge analysis, radius of curvature analysis, ridge line analysis, shape error analysis